ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,090, issued on Feb. 3, was assigned to ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA (Tucson, Ariz.). "Photo-magnetically ... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,819, issued on Feb. 3, was assigned to LEICA GEOSYSTEMS AG (Heerbrugg, Switzerland). "Surveying pole and secondary sensor unit having toroid... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,688, issued on Feb. 3, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo). "Flexible organic EL display device, and front panel for displa... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,482, issued on Feb. 3, was assigned to Beijing Baidu Netcom Science Technology Co. Ltd. (Beijing). "Communication method and apparatus for c... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,369, issued on Feb. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Transistor stacking by wafer bonding" was invented by Mark I. Gardner (... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,671, issued on Feb. 3, was assigned to Capital One Services LLC (McLean, Va.). "Deterministic crypto-random values for cryptographic operati... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,915, issued on Feb. 3, was assigned to University of Utah Research Foundation (Salt Lake City). "Micro-balance biosensors to detect whole vi... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,445, issued on Feb. 3, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing). "Display substrate" was invented by Lei Zhao (... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,956, issued on Feb. 3, was assigned to Airbus Operations GmbH (Hamburg, Germany) and Airbus SAS (Blagnac, France). "Thermal and acoustic ins... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,353, issued on Feb. 3, was assigned to Socionext Inc. (Kanagawa, Japan). "Semiconductor device and semiconductor device manufacturing method... Read More